Ultrasonic cutting device for cross-sectional observation for semiconductors / industrial machinery
No resin embedding! Streamlining the production of cross-sectional samples for micro-machining.
In the semiconductor industry, accurate cross-sectional observation of finely processed components is essential for product quality control and yield improvement. It is particularly important to detect subtle defects and structural issues early in the manufacturing process and take appropriate measures. Traditional cross-section sample preparation requires time and specialized skills, hindering efficient analysis. Our ultrasonic cutting device addresses these challenges and streamlines SEM observation. 【Usage Scenarios】 - Cross-sectional observation of finely processed semiconductor devices - Failure analysis, defect analysis - Verification of manufacturing conditions 【Benefits of Implementation】 - Cross-sections are finished very cleanly, improving observation accuracy - No specialized skills are required, allowing anyone to produce stable cross-sections - Significantly reduces ion milling time before SEM observation
- Company：日精 本社
- Price：10 million yen-50 million yen
